CTII has introduced a new epoxy curative additive designated CELLCURE N2C, an elevated temperature curing agent for adhesives, electronic encapsulation and pre-preg composites. CELLCURE N2C is a low viscosity liquid, soluble in water and polar organic solvents and can be used at low loading levels (1-4 phr) in both liquid and solid epoxy resins. CELLCURE N2C acts as an accelerator for dicyandiamide, phenolic and anhydride curing agents and gives high Tg (>150º C) in heat-cured epoxy systems. Average curing times using N2C in electronic encapsulation epoxies at 150º C are: 6 seconds (10 wt%, 1.47 mole/kg), 10 seconds (7 wt%, 1.03 mole/kg) and 18 seconds (5 wt%, 0.734 mole/kg). N2C-cured epoxies are black in color.

CELLCURE N2C can be used as a replacement for similar products such as IMICURE® AMI-1 currently available on the market. (IMICURE is a registered trademark of Air Products and Chemicals, Inc., Allentown, PA)

For more information, contact CTII at info@cellulartechnology.us.